Analysis of CNN, LSTM, and Transformer Models for Detecting Hall Sensor Inaccuracy in BLDC Motor Drives, IEEE Access Submitted 2023 (SCIE)

Simple Novel Back EMF Zero Crossing Point Detection Method for Sensorless BLDC Motor Drive,IEEE ACCESS Submitted 2023 (SCIE)

A study on demagnetization heat treatment of waste neodymium iron boron (NdFeB) magnets by using computer simulation, PeerJ Materials Science 5  2023

Validity Improvement In MolGAN-Based Molecular Generation, Volume: 11, Page(s): 58359 - 58366 IEEE Access 2023 (SCIE) 

Transparent and Flexible Patch Antenna Using MMF for Conformal WiFi-6E Applications, Journal of Electromagnetic Engineering and Science, vol. 23, no. 4 July 2023 (SCIE)

Multi-Class Object Detection UsingAdaptive Non-Maximum Suppression in Dense Images, IEEE TechRxiv 2022

OBJECT DETECTION IN DENSE IMAGES USING ADAPTIVE NON-MAXIMUM SUPPRESSION, IEEE International Conference in Image Processing (ICIP) Submitted 2022

Single-Class Object Detection in Dense Images Using Adaptive Non-Maximum Suppression, IEEE Transactions on Pattern Analysis and Machine Intelligence (TPAMI), Submitted 2022 (SCI)

Online Monitoring of Power Converter Degradation Using Deep Neural Network, Applied Sciences  2021, 11(24),11796 (SCIE)

A Study on Multiple Factors Affecting the Accuracy of Multi-class Skin Disease Classification, Applied Sciences  2021, 11(17), 7929(SCIE)

A Transfer Learning Architecture Based on Support Vector Machine for Histopathology Image Classification, Applied Sciences 2021, 11(14), 6380(SCIE)

Image Classification Using Fusion of Multiple Neural Networks, IEEE, ITC CSCC, Jeju, S.Korea 2021

Improvement of Object Detection Based on Faster R-CNN and YOLO, IEEE, ITC CSCC, Jeju, S.Korea 2021

Application of Transfer Learning for Image Classification on Dataset with Not Mutually Exclusive Classes, IEEE, ITC CSCC, Jeju, S.Korea 2021

Extending Maximum Speed of Torque Sharing Function Method in Switched Reluctance Motor, IEEE, ICECCE, KUALA LUMPUR, MALAYSIA, 2021

Copper Loss Reduction of Torque Sharing Function in Switched Reluctance Motor by Division of Commutation Region, IEEE, ICECCE, KUALA LUMPUR, MALAYSIA, 2021

Dynamic Measurement of Magnetic Characteristics of Switched Reluctance Motor,  Electrical Engineering & Electromechanics, Volume 2 2023 (SCOPUS/ESCI)

Position Estimation of a Two Phase Switched Reluctance Motor at Standstill, Machines 9(12), 359  2021 (SCIE)

Position Detection of Switched Reluctance Motor Using Harmonics of Current, IEEE Canadian Journal of Electrical and Computer Engineering, Submitted 2020 (SCIE)

Online Detection of Phase Resistance of Switched Reluctance Motor by Sinusoidal Signal Injection, Machines, Submitted 2022 (SCIE)

A Pulse Injection Method based Position Sensorless Control of Switched Reluctance Motor Considering the Effect of the Back-EMF, IEEE Canadian Journal of Electrical and Computer Engineering, Submitted 2020 (SCIE)

Study on manufacturing and processing technology of radiation shielding by chemical composite materials, Bulletin of the Korean Chemical Society, Submitted 2019 (SCIE)

Position Sensorless Control of Switched Reluctance Motor based on a Simple Flux Linkage Model,  Electrical Engineering & Electromechanics, Volume. 3 2023 (SCOPUS/ESCI)

A Novel Average Torque Control of Switched Reluctance Motor based on Flux-Current Locus Control, IEEE Canadian Journal of Electrical and Computer Engineering, Volume: 43, Issue: 4 Fall 2020 (SCIE)

Design consideration to achieve wide-speed-range operation in switched reluctance motor, IEEE Canadian Journal of Electrical and Computer Engineering, Volume: 43, Issue: 4 FALL 2020 (SCIE)

A Concept of Accelerating the Demagnetization of Switched Reluctance Motor, IEEE Canadian Journal of Electrical and Computer Engineering, Volume: 43, Issue: 4 Fall 2020 (SCIE)

Evaluation of the Voltage Estimation Method in Position Sensorless Control of Switched Reluctance Motor, IET Letters, Submitted 2019 (SCIE)

A Novel Method to Minimize Overall Torque Ripple in Presence of Phase Current Shift Error for Three-Phase BLDC Motor Drive IEEE Canadian Journal of Electrical and Computer Engineering,volume 42, issue 4, Winter 2019 (SCIE)

Commutation Torque Ripple Minimization for Three Phase BLDC Motor Drive using A Simple PWM Scheme Reliable to Motor Parameter Variation,IEEE APPEEC MACAU Dec. 2019

Power Efficiency Analysis of Three-phase Inverter for BLDC Motor Drive with Varying Speed and Load Torque,  IEEE APPEEC MACAU Dec. 2019

Analysis of Three-Phase Inverter Power Efficiency for BLDC Motor Drive using Conventional six-step and Inverted PWM Driving Scheme, IEEE Canadian Journal of Electrical and Computer Engineering, volume 42, issue 1, Winter 2019 (SCIE)

A Novel Enhanced Inverted PWM Driving Scheme for Three-Phase BDLC Motor Drive, IEEE ICCE-ASIA JEJU S.Korea JUNE 2018

Analysis of Bootstrap Circuit Operation with Inverted PWM Drive Scheme for Three-Phase Inverter for BLDC Motor Drive  IEEE Canadian Journal of Electrical and Computer Engineering, volume 42, issue 1, Winter 2019 (SCIE)

Analysis of Torque Ripple and its Peak Value, if any Phase Current Shift error, for BLDC Motor Drive , IEEE APPEEC MACAU Dec. 2019

Overall Torque Ripple Reduction by Constant Band Hysteresis Current Controller with Back EMF Phase Shift Error Compensator in BLDC Motor Drive,  IEEE ICEIC2020 Barcelona Spain Jan. 2020 

A simple method for measuring cogging torque in BLDC motors using a dynamometer IEEE ICCE-ASIA JEJU S.Korea JUNE 2018

Torque Ripple and Switching Power Loss Minimization with Constant Band Hysteresis Current Controller for BLDC Motor,  IEEE APPEEC MACAU Dec. 2019

Design of Bus-side RCD Snubber Circuit for Three Phase High Power Inverters, IEEE Canadian Journal of Electrical and Computer Engineering, volume 41, issue 1, pp. 55 - 61,Winter 2018(SCIE)

Improvement and Reduction of Common Mode Voltage in Active Zero Space Vector Pulse Width Modulation in Three-Phase Inverter IEEE ITEC AUG.2017

Simple Novel Method to Reduce Common Mode Voltage in Space Vector Pulse Width Modulation Driving Three-Phase Inverter ICEIC Hawaii USA 2018

A Simple Novel Method for Reduction of Circulating Current in Interleaved Three-Phase Inverters IEEE COMPEL JULY 2017

Monitoring On-Resistance of MOSFET Devices in Real Time for SVPWM-VSI with Direct Compensation, IEEE Canadian Journal of Electrical and Computer Engineering,  volume 41, issue 1,pp. 28 - 34,80.Winter 2018 (SCIE)

79. Rotor Flux and Rotor Resistance Estimation using Extended Luenberger-Sliding Mode Observer (ELSMO) for Sensorless Three Phase Induction Motor Control, IEEE Canadian Journal of Electrical and Computer Engineering, Volume: 40, Issue: 3 Pages: 181 - 188, 2017 (SCIE)

A Sensorless Speed Estimation for Indirect Vector Control of Three-Phase Induction Motor Using Extended Kalman Filter, IEEE TENCON 2016, Nov, 2016

A Method to Improve Flux Estimation Under Gaussian Noise in Sensorless Stator Flux Control of Induction Motors, IEEE Industrial Electronics and Applications Conference 2016 (IEACON 2016), Nov, 2016

Improvement of Flux Estimation using Programmable Low Pass Filter with Synchronous Angular Frequency Error Compensator in Sensorless AC Induction Motor, IEEE Transportation Electrification Conference (ITEC) and Expo Asia-Pacific, BUSAN, Korea 2016

C++ Based Dynamic Model of AC Induction Motor in Discrete Time Domain, IEEE Transportation Electrification Conference (ITEC) and Expo Asia-Pacific, BUSAN, Korea 2016

Suppressing Fast Load Transients and Improving Dynamic Performance in DC Telecom Power Systems and Data Centers, Proceedings of the IEEE International Telecommunications Energy Conference, Vancouver BC Canada 2014

A Feedforward Control Method of Dual-Active-Bridge DC/DC Converter to Achieve Fast Dynamic Response, Proceedings of the IEEE International Telecommunications Energy Conference, Vancouver BC Canada 2014

Design optimization of the outlet holes for bone crystal growing with bioactive materials in dental implants: Part II. number and shapes, Journal of the Korean Crystal Growth and Crystal Technology 2 (23):76-80 2013

Effects of Convection on Physical Vapor Transport of HG2CL2 in the Presence of KR – Part I: Under Microgravity Environments,, Journal of the Korean Crystal Growth and Crystal Technology 1 (23):20-26 2013

One-Chip Multi-Output SMPS using a Shared Digital Controller and Pseudo Relaxation Oscillating Technique, Journal of the Institute of Electronics and Information Engineers (50):148-156 2013

Design optimization of dental implants using finite element analysis for injecting bioactive materials, Korean Journal of Materials Research 6 (22):292-297 2012

Mechanical Flexibility of Zinc Oxide Thin-Film Transistors Prepared by Transfer Printing Method, Modern Physics Letter B 12 (26) 2012 (SCIE)

Optimal Condition of Hydroxyapatite Powder Plasma Spray on Ti6Al4V Alloy for Implant Applications, Korean Journal of Materials Research 4(22):211-214 2012

Effects of DC Biases and Post-CMP Cleaning Solution Concentrations on the Cu Film Corrosion, Corrosion Science and Technology 6(9):276-280 2010

A Method for Real Time Monitoring of Oxide Thickness Plasma Electrolyte Oxidation of Titanium , Corrosion Science and Technology 2010

EFFECTS OF ELECTRICAL PARAMETERS ON TITANIA FILM GROWN BY MICRO ARC OXIDATION Modern Physics Letters B 23(16) 2009 (SCIE)

EFFECT OF EXCESS NEGATIVE IONS ON ANODIC OXIDATION IN MICROARC OXIDATION OF TITANIUM Modern Physics Letters B 23(6) 2009 (SCIE)

Study of Micro Arc Oxidation of AZ31B Magnesium Alloy in Alkaline Silicate Solution Electrochemistry Communication(10) 2008 (SCIE)

CONTROLLING INSTABILITIES OF HYDROGENERATED a-Si:H TFT UNDER BIAS TEMPERATURE STRESSING Modern Physics Letters B 22(4) 2008 (SCIE)

COMPARATIVE INSTABILITIES ANALYSIS FOR a-Si:H BODY-TIED TFT (BT-TFT) AND FLOATING BODY TFT (FB-TFT) UNDER BIAS TEMPERATURE STRESSING (BTS), Modern Physics Letters B 22(5) 2008 (SCIE)

Leakage Current Conduction Behavior of Fluorinated Polyimide Film, Modern Physics Letters B 20(6):315-320 2006 (SCIE)

Study of Charges in Fluorinated Polyimide Film by using Capacitance-Voltage Method, Modern Physics Letters B 20(7) 2006 (SCIE)

Study of Hysteresis Behavior of Charges in Fluorinated Polyimide Film by using Capacitance-Voltage Method, Modern Physics Letters B 20(8) 2006 (SCIE)

Study on SiNx passivated Cu/Ta/SiO2/Si multilayer structure Journal of Materials Science 37(19): 4181-4188; Oct 2002 (SCI)

Behaviour of ionized metal plasma deposited Ta diffusion barrier between Cu and SiO2 Journal of Materials Science 37(10): 1941-1949; May 2002 (SCIE)

Interfacial reactions and failure mechanism of Cu/Ta/SiO2/Si multilayer structure in thermal annealing, Materials Science and Engineering B Volume 94, Issue 1 , 15 June 2002, Pages 111-120 (SCIE)

53. Effect of the silicon nitride passivation layer on the Cu/Ta/SiO2/Si multi-layer structure Materials Science and Engineering B Volume 90, Issues 1-2 , 7 March 2002, Pages 25-33 (SCIE)

FORMATION ENANCEMENT OF THE C54-TiSi2 BY A MULTI-CYCLE PRE-COOLING TREATMENT International Journal of Modern Physics B, Vol. 16, Nos. 1 & 2 (2002) 213-218 (SCIE)

FORMATION OF SEMI-COHERENT INTERFACE IN TiSi2/Si STRUCTURE International Journal of Modern Physics B, Vol. 16, Nos. 1 & 2 (2002) 249-253 (SCIE)

Diffusion barrier properties of ionized metal plasma deposited tantalum nitride thin films between copper and silicon dioxide Journal of Materials Science 36(24): 5845-5851; Dec 2001 (SCIE)

Study on electroplated copper thin film and its interfacial reactions in the EPCu/IMPCu/IMPTaN/SiO2/Si multilayer structure Journal of Materials Science 36(22): 5475-5480; Nov 2001 (SCIE)

Comparative study of copper films prepared by ionized metal plasma sputtering and chemical vapor deposition in the Cu/TaN/SiO2/Si multilayer structure Journal of Materials Science 36(23): 5705-5712; Dec 2001 (SCIE)

The impact of layer thickness of IMP-deposited tantalum nitride films on integrity of Cu/TaN/SiO2/Si multilayer structure Materials Science and Engineering B Volume 84, Issue 3 , 20 July 2001, Pages 217-223 (SCIE)

Study of electroplated copper thin film and its interfacial reactions in the EPCu/IMPCu/IMPTaN/SiO2/Si multilayer structure Journal of Materials Science Letters 20(6): 559-562; Mar 2001 (SCIE)

Effective Enhancement of C54 TiSi2 Phase Formation with Multi-Thermal-Shock Processing at 600C, Applied Physics Letters, Vol. 79 No. 8 August 20, 2001 (SCIE)

 Interfacial reactions and mechanism of C54 TiSi2 phase formation enhanced by multi-thermal shock processing. Appl. Phys. Lett., L01-0699, 2001 (SCIE)

Effect of Pre-cooling Treatment on the Formation of the Low Resistivity Titanium Silicide, Journal of Vacuum Science and Technology B 19(2) March/April 2001 (SCIE)

Properties of electroplated copper thin film and its interfacial reactions in the EPCu/IMPCu/IMPTaN/SiO2/Si multilayer structure Materials Science and Engineering B Volume 83, Issues 1-3 , 21 June 2001, Pages 1-7 (SCIE)

FORMATION MECHANISM AND CRYSTALLOGRAPHIC RELATIONSHIP OF EPITAXY Ti AND Al THIN FILMS IN IONIZED METAL PLASMA DEPOSITION Surface Review and Letters, Vol. 8, No. 5 (2001) 465-469 (SCIE)

STUDY OF Cu DIFFUSION IN Cu/TaN/SiO2/Si MULTILAYER STRUCTURES Surface Review and Letters, Vol. 8, No. 5 (2001) 527-532 (SCIE)

High Density Diffusion Barrier of Ionised Metal Plasma Deposited Ti in Al-0.5%Cu/Ti/SiO2/Si Structure, J. Vacuum Sci. Tech. B, 19 [2], 388-396 (2001) (SCIE)

BEHAVIOUR OF ELECTROPLATED COPPER FILM IN THE EPCu/IMPCu/IMPTaN/SiO/Si MULTILAYER STRUCTURE 2001 MRS Spring Meeting San Francisco CA USA 

Effect of pre-cooling treatment on the formation of C54 phase titanium silicide 2001 MRS Spring Meeting San Francisco CA USA

Effects of a thin flash copper layer on the diffusion of Cu, Ta, Si and O in the Cu/TaN/SiO2/Si Structure, International Solid State Technology Conference, pp. 116, 2001.

Interfacial Behaviour in TiSi2/Si Thin Film Structure, Proceeding of Eight International Conference on Composites Engineering, Tenerife, Spain, August 5-11, 559, 2001

Effect of Pre-cooling Treatment on the Formation of the Low Resistivity Titanium Silicide, the 2nd International AVS Conference on Microelectronics and Interfaces, Santa Clara, California, USA, February, 2001

Enhancement of the Formation of the C54-TiSi2 through the Introduction of a Multi-cycle Pre-cooling Treatment, ICMAT, 2001

Formation of Semi-Coherent Interface in TiSi2/Si Structure, ICMAT, 2001.

ARM7TDMI Platform based SOC Design for Bluetooth Baseband Processor Design for Personal Area Networking Application Interim Report for MSI, August 15, 2001

Study of interfacial reactions in ionized metal plasma (IMP) deposited Al-0.5%wtCu/Ti/SiO2/Si structure Journal of Materials Science 35(23): 5857-5860; Dec 2000 (SCIE)

Irreversible hydrogen effects on resistivity of sputtered copper films Journal of Materials Science 35(23): 6035-6040; Dec 2000 (SCI)

Characterization of interfacial reactions between ionized metal plasma deposited Al.0.5 wt.% Cu and Ti on SiO2 Materials Science and Engineering B Volume 77, Issue 1 , 7 August 2000, Pages 101-105 (SCIE)

Study of diffusion barrier properties of ionized metal plasma (IMP) deposited TaN between Cu and SiO2 Materials Science in Semiconductor Processing Volume 3, Issue 3 , June 2000, Pages 179-184 (SCIE)

Study of diffusion barrier properties of ternary alloy (TixAlyNz) in Cu/TixAlyNz/SiO2/Si thin film structure Materials Science in Semiconductor Processing Volume 3, Issue 3 , June 2000, Pages 191-194 (SCIE)

Effect of multi-cycle annealing on the C49.C54 phase transformation in TiSi2 thin film Materials Science in Semiconductor Processing Volume 3, Issue 3 , June 2000, Pages 215-219 (SCIE)

Comparative analysis and study of ionized metal plasma (IMP)-Cu and chemical vapor deposition (CVD)-Cu on diffusion barrier properties of IMP-TaN on SiO2 Materials Science and Engineering B Volume 77, Issue 3 , 29 September 2000, Pages 282-287 (SCIE)

Comparative Analysis and Study of IMP (Ionized Metal Plasma)-Cu and CVD (Chemical Vapor Deposit)-Cu on Diffusion Barrier Properties of IMP-Ta, 17th VMIC(VLSI Multilevel Interconnection Conference) Conference proceedings, 2000, Santa Clara, USA

Fabrication of High Density Diffusion Barrier with Ionized Metal Plasma Deposition in Al-0.5%Cu/Ti/SiO2/Si Structure, The First International Conference on Advanced Materials Processing, Rotorua, New Zealand, 19-23 November 2000, 407.

Effect of flash copper on Cu Diffusion, ISMA, Singapore, 200060. Behaviour of Electroplated Copper film in the EPCu/IMPCu/IMPTaN/SiO2/Si Multilayer Structure, 1st International Conference Advanced Materials Processing, Rotorua, New Zealand, 2000

Investigation of a New Processing Method to Enhance the C54-TiSi2 Phase Formation, 1st International Conference Advanced Materials Processing, Rotorua, New Zealand, 2000

The Mechanism of Epitaxy Ti Thin Film Formation in Ionic Metal Plasma Deposition, International Symposium on the Science of Surfaces and Nanostructures Singapore 2000

Frequency Estimation and Convolution Coding Module ASIC Design for ISM Band DSSS Modulation in Multipath and AWGN, Interim Report for MSI, June 24, 2000

Synchronization Module ASIC Design in ISM Band Modems using a Preamble for IEEE802.11b Modem, Interim Report for MSI, Oct. 31, 2000.

Enhancement on BER with Post-processing Unit for DVD Application, Interim Report for MSI and DSI, Nov. 15, 2000

A Low Power Viterbi Decoder Design for Wireless Communications Applications, Interim Report for MSI, Dec. 15, 2000.

Effect of hydrogen and temperature on the resistivity of an aluminum-2 wt% copper thin film Journal of Materials Science 34(14): 3427-3436; Jul 1999 (SCIE)

Study of diffusion barrier properties of ionized metal plasma (IMP) deposited tantalum (Ta) between Cu and SiO2 Materials Science and Engineering B Volume 68, Issue 2 , 27 December 1999, Pages 99-103 (SCIE)

Effect of heat transfer on the C49.C54 phase transformation in TiSi2 thin film Materials Science in Semiconductor Processing Volume 2, Issue 4 , 1 December 1999, Pages 329-333 (SCIE)

Study of Diffusion Barrier Properties of Ionized Metal Plasma (IMP) Deposited TaN Between Cu and SiO2, 16th VMIC(VLSI Multilevel Interconnection Conference) Conference proceedings, 1999, Santa Clara, USA

ANALYSIS OF RESISIVITY MEASUREMENTS ON THIN FILMS. 1st Conference on Thermophysical Properties of Materials, Singapore, Nov 1999

Effect of post-metal annealing on the quality of thermally grown silicon dioxide on 6H- and 4H-SiC. Materials Science Forum. v 264-268 n pt 2 1998. p 849-852 (SCIE)

Effect of PMA on effective fixed charge in thermally grown oxide on 6H-SiC, IEE Electronics Lett., Vol.34(7), pp.698-700, April, 1998 (SCIE)

Characterization of the imidization process of Low K-fluorinated polymide film during thermal curing Journal of Materials Science 33(22): 5423-5426; Nov 1998

Preparation and Characterization of Reworkable High Temperature Adhesives for Microelectronic Applications. ECTC Conference Proceedings, 1998, USA

Thermal Curing Conditions for Low K-Fluorinated Polyimide Film for Use as the Interlayer Dielectric in ULSI Low-Dielectric Constant Materials. Materials Research Society Symposium Proceedings. v 443 1997. MRS, Warrendale, PA, USA. p 71-77

Growth and Characterization of Thermal Silicon dioxide on 6H-SiC, 11th Annual Symposium of the Laboratory for Surface Modification, State University of New Jersey, at Rutgers, NJ 08855, Feb. 13, 1997. USA

Effects of Post Metal Annealing on the Quality of Thermally Grown Silicon Dioxide on 6H- and 4H-SiC ICSCIII-N '97 International Conference on Silicon Carbide, III-Nitrides and Related Materials August 31 - September 5, 1997 Stockholm Sweden

Reactive Ion Etching of the Fluorinated Polyimide Film Advanced Metallization for Future ULSI. Materials Research Society Symposium Proceedings. v 427 1996. Materials Research Society, Pittsburgh, PA, USA. p 455-461

Investigations of the Low Dielectric Constant Fluorinated Polyimide for Use as the Interlayer Dielectric in ULSI Low-Dielectric Thin Films for Micoelectronics Applications. Materials Research Society Symposium Proceedings. v 381 1995. Materials Research Society, Pittsburgh, PA, USA. p 31-43